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IEEE Electron Device Letters > 2010 > 31 > 5 > 446 - 448
IEEE Transactions on Industrial Electronics > 2010 > 57 > 1 > 181 - 192
IEEE Transactions on Advanced Packaging > 2010 > 33 > 1 > 180 - 188
IEEE Transactions on Applied Superconductivity > 2010 > 20 > 3 > 364 - 367
2009 IEEE Energy Conversion Congress and Exposition > 2247 - 2254
2009 IEEE Energy Conversion Congress and Exposition > 1417 - 1424
2009 IEEE Energy Conversion Congress and Exposition > 2614 - 2620
2009 IEEE Energy Conversion Congress and Exposition > 2827 - 2832
IEEE Transactions on Power Delivery > 2009 > 24 > 3 > 1029 - 1036
IEEE Transactions on Applied Superconductivity > 2009 > 19 > 3-3 > 3119 - 3122
IEEE Electron Device Letters > 2009 > 30 > 5 > 550 - 552
IEEE Electron Device Letters > 2009 > 30 > 1 > 33 - 35
IEEE Transactions on Instrumentation and Measurement > 2009 > 58 > 7 > 2181 - 2188
IEEE Transactions on Advanced Packaging > 2009 > 32 > 2 > 509 - 516
IEEE Transactions on Magnetics > 2009 > 45 > 5-2 > 2316 - 2319
IEEE Photonics Technology Letters > 2009 > 21 > 2 > 118 - 120
Ieee transactions on components and packaging technologies > 2009 > 32 > 1 > 120 - 126
IEEE Transactions on Instrumentation and Measurement > 2009 > 58 > 5 > 1789 - 1796
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2009 > 17 > 12 > 1730 - 1741